Inventor · disambiguated record
Hsing-Chih Liu
Also filed as: LIU HSING-CHIH
21 granted patents·5 pending applications·29 citations·filing 2014–2024
91Inventor score
Files withMEDIATEK INC26
Top patents by PatentIndex Score
26 records- 0197US11710688B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Jul 25, 2023·6 cites·20 claims
- 0297US11227846B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Jan 18, 2022·7 cites·14 claims
- 0394US12095142B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2022·Granted Sep 17, 2024·2 cites·13 claims
- 0492US10847869B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2018·Granted Nov 24, 2020·9 cites·23 claims
- 0584US12300679B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted May 13, 2025·1 cites·19 claims
- 0680US11302657B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Apr 12, 2022·1 cites·9 claims
- 0778US2025015483A1Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0877US9129962B1Bonding pad arrangment design for multi-die semiconductor package structureMEDIATEK INC·Filed 2014·Granted Sep 8, 2015·3 cites·21 claims
- 0975US11967570B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2022·Granted Apr 23, 2024·0 cites·12 claims
- 1073US11705413B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 1171US12165961B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1268US11509038B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1365US11908759B2Semiconductor deviceMEDIATEK INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1464US11721882B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Aug 8, 2023·0 cites·14 claims
- 1559US12230560B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Feb 18, 2025·0 cites·19 claims
- 1659US11908767B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 1757US2023307421A1Package-on-package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1857US2023422525A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1956US11776899B2Via array design for multi-layer redistribution circuit structureMEDIATEK INC·Filed 2021·Granted Oct 3, 2023·0 cites·19 claims
- 2055US9991227B2Bonding pad arrangement design for multi-die semiconductor package structureMEDIATEK INC·Filed 2016·Granted Jun 5, 2018·0 cites·11 claims
- 2152US9564395B2Bonding pad arrangment design for multi-die semiconductor package structureMEDIATEK INC·Filed 2015·Granted Feb 7, 2017·0 cites·22 claims
- 2249US11244913B2Semiconductor packageMEDIATEK INC·Filed 2019·Granted Feb 8, 2022·0 cites·19 claims
- 2349US10910323B2Semiconductor package with reduced noiseMEDIATEK INC·Filed 2019·Granted Feb 2, 2021·0 cites·14 claims
- 2449US2018102298A1Semiconductor deviceMEDIATEK INC·Filed 2017·Application pending·0 cites
- 2539US10074628B2System-in-package and fabrication method thereofMEDIATEK INC·Filed 2016·Granted Sep 11, 2018·0 cites·12 claims
- 2638US2018294255A1Method for fabricating microelectronic package with surface mounted passive elementMEDIATEK INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →