Inventor · disambiguated record
Hsiang-Po Liu
Also filed as: LIU HSIANG-PO
2 granted patents·3 pending applications·2 citations·filing 2021–2025
37Inventor score
Files withWINBOND ELECTRONICS CORP5
Top patents by PatentIndex Score
5 records- 0185US11631675B2Semiconductor memory structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 18, 2023·2 cites·16 claims
- 0267US2024312791A1Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0360US2025338605A1Integrated circuit structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0458US12020945B2Dynamic random access memory and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 25, 2024·0 cites·15 claims
- 0550US2025267851A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →