Inventor · disambiguated record

Hsiang-Wei Liu

Also filed as: LIU HSIANG · LIU HSIANG-WEI

50 granted patents·11 pending applications·196 citations·filing 1996–2025

98Inventor score

Technology areasH10P H10W H05K G11B H03M

Files withTAIWAN SEMICONDUCTOR MFG CO LTD48 LIU HSIANG-WEI4 ADVANCED MICRO DEVICES INC2 GLOBAL UNICHIP CORP2 QUANTA COMP INC2

Top patents by PatentIndex Score

61 records

0197US11729969B1Semiconductor device and method of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·5 cites·20 claims
0297US10269715B2Split rail structures located in adjacent metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·29 cites·20 claims
0397US10020261B2Split rail structures located in adjacent metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 10, 2018·31 cites·20 claims
0493US10290580B2Hybrid copper structure for advance interconnect usageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·7 cites·20 claims
0591US10147609B2Semiconductor epitaxy bordering isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 4, 2018·5 cites·20 claims
0691US9607881B2Insulator void aspect ratio tuning by selective depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 28, 2017·13 cites·20 claims
0789US9837354B2Hybrid copper structure for advance interconnect usageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 5, 2017·7 cites·20 claims
0887US10930551B2Methods for fabricating a low-resistance interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
0987US10522353B2Semiconductor epitaxy bordering isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·20 claims
1085US11302570B2Interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·4 cites·20 claims
1185US10957540B2Semiconductor epitaxy bordering isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·2 cites·20 claims
1284US10957580B2Metal routing with flexible space formed using self-aligned spacer patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 23, 2021·1 cites·20 claims
1382US10818597B2Hybrid copper structure for advance interconnect usageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·2 cites·20 claims
1482US10529617B2Metal routing with flexible space formed using self-aligned spacer patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·2 cites·20 claims
1581US12278143B2Method of providing a workpiece including low resistance interconnect low-resistance interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
1681US2025294731A1Novel metal fuse structure by via landingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1780US10534273B2Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·2 cites·20 claims
1880US2024085803A1Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
1979US2024389312A1Metal fuse structure by via landingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2078US11860550B2Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
2177US11901295B2Dielectric film for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
2277US10734275B2Metal routing with flexible space formed using self-aligned spacer patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·1 cites·20 claims
2376US12058852B2Semiconductor device and method of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
2476US9583434B2Metal line structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 28, 2017·2 cites·20 claims
2576US2025329401A1Memory device, layout, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2675US12051646B2Metal line structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
2775US9219494B2Dual mode analog to digital converterGLOBAL UNICHIP CORP·Filed 2014·Granted Dec 22, 2015·5 cites·18 claims
2875US5824457AUse of WEE (wafer edge exposure) to prevent polyimide contaminationTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Oct 20, 1998·45 cites·23 claims
2975US2024389311A1Multiple pattern metal fuse manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3074US11658032B2Semiconductor epitaxy bordering isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
3173US11769695B2Semiconductor structure including low-resistance interconnect and integrated circuit device having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
3272US12002709B2Interconnect structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
3372US6819556B2Server system and vibration-free extractable hard disc drive assembly thereofQUANTA COMP INC·Filed 2003·Granted Nov 16, 2004·8 cites·20 claims
3471US12324149B2Metal fuse structure by via landingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
3571US10658296B2Dielectric film for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 19, 2020·1 cites·20 claims
3671US10276396B2Method for forming semiconductor device with damascene structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
3770US7307838B2Hard disc drive carrierQUANTA COMP INC·Filed 2005·Granted Dec 11, 2007·5 cites·12 claims
3869US11107725B2Interconnect structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·19 claims
3968US12493731B2Multiple pattern metal fuse device, layout, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
4068US9425089B2Conductive element structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·1 cites·20 claims
4166US11101216B2Metal line structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
4265US11422475B2Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
4365US11296027B2Dielectric film for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·0 cites·20 claims
4464US12380957B2Memory device, layout, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 5, 2025·0 cites·20 claims
4562US10784151B2Interconnect structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
4662US10522469B2Split rail structures located in adjacent metal layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 31, 2019·0 cites·20 claims
4761US11152306B2Dielectric film for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 19, 2021·0 cites·19 claims
4860US2025210600A1System-on-chip gap fill method and structureADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
4959US2025157973A1Systems and methods for reducing semiconductor device delaminationADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
5058US10490500B2Metal line structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 26, 2019·0 cites·20 claims

Showing the top 50 of 61 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →