Inventor · disambiguated record
Hsiu-Chi Liu
Also filed as: LIU HSIU-CHI
5 granted patents·5 citations·filing 2019–2022
67Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG5
Top patents by PatentIndex Score
5 records- 0195US11342282B2Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·26 claims
- 0288US12374631B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 29, 2025·1 cites·14 claims
- 0354US11798858B2Semiconductor package structure including reinforcement component and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 24, 2023·0 cites·16 claims
- 0448US11094649B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 17, 2021·0 cites·26 claims
- 0543US10943843B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 9, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →