Inventor · disambiguated record
Hsueh-Chung Shelton Lu
Also filed as: LU HSUEH-CHUNG SHELTON
7 granted patents·174 citations·filing 2002–2017
81Inventor score
Top patents by PatentIndex Score
7 records- 0194US10504847B2Chip package structure and chip package structure arraySHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Dec 10, 2019·14 cites·22 claims
- 0294US6680544B2Flip-chip bump arrangement for decreasing impedanceVIA TECH INC·Filed 2002·Granted Jan 20, 2004·142 cites·9 claims
- 0363US6741901B2System and method for coordinated inter-organizational information sharingVIA TECH INC·Filed 2003·Granted May 25, 2004·18 cites·10 claims
- 0444US7504726B2Chip and manufacturing method and application thereofVIA TECH INC·Filed 2006·Granted Mar 17, 2009·0 cites·14 claims
- 0541US10756077B2Chip packaging methodSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 25, 2020·0 cites·11 claims
- 0638US11081371B2Chip package processVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 3, 2021·0 cites·11 claims
- 0737US11227848B2Chip package array, and chip packageVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Jan 18, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →