Inventor · disambiguated record

Hsin-Ying Peng

Also filed as: PENG HSIN-YING

4 granted patents·3 pending applications·4 citations·filing 2021–2025

65Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD7

Top patents by PatentIndex Score

7 records

0192US11742290B2Interconnect structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·2 cites·20 claims
0285US12469745B2Conductive structures with bottom-less barriers and linersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
0385US12354958B2Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·1 cites·21 claims
0478US12165975B2Method of forming interconnect structure having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
0577US2025364324A1Conductive structures with bottom-less barriers and linersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0677US2024413087A1Interconnect Structure and Method of Forming ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0772US2024387381A1Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →