Inventor · disambiguated record
Hsin-Ya Peng
Also filed as: PENG HSIN-YA
2 granted patents·2 pending applications·24 citations·filing 2004–2005
58Inventor score
Top patents by PatentIndex Score
4 records- 0170US7008821B1Method of forming a wafer backside interconnecting wireTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Mar 7, 2006·21 cites·20 claims
- 0265US7192842B2Method for bonding wafersTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Mar 20, 2007·3 cites·12 claims
- 0335US2005215029A1Method for fixing wafer used in manufacturing procedureWALSIN LIHWA CORP·Filed 2004·Application pending·0 cites
- 0434US2006030130A1Method of dicing a waferSHAO SHIH-FENG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →