Inventor · disambiguated record
Hsuan Peng
Also filed as: PENG HSUAN · PENG HSUAN-WEN
5 granted patents·3 pending applications·29 citations·filing 2000–2019
73Inventor score
Top patents by PatentIndex Score
8 records- 0181US9766749B2Touch device and sensing compensation methodIND TECH RES INST·Filed 2014·Granted Sep 19, 2017·9 cites·25 claims
- 0277US6619940B1Method and device for clamping electromagnetically molds of injection molding machineIND TECH RES INST·Filed 2001·Granted Sep 16, 2003·19 cites·4 claims
- 0357US10939102B2Post processing apparatus with super-resolution filter and loop restoration filter in block-level pipeline and associated post processing methodMEDIATEK INC·Filed 2019·Granted Mar 2, 2021·0 cites·18 claims
- 0446US6540494B2Linkage type mold clamping device driven by electromagnetic forceIND TECH RES INST·Filed 2001·Granted Apr 1, 2003·1 cites·7 claims
- 0540US2003215565A1Method and apparatus for the formation of laminated circuit having passive components thereinIND TECH RES INST·Filed 2003·Application pending·0 cites
- 0635US2003009726A1Method and apparatus for the formation of laminated circuit having passive componets thereinIND TECH RES INST·Filed 2001·Application pending·0 cites
- 0730US6371196B1Injection molding apparatusIND TECH RES INST·Filed 2000·Granted Apr 16, 2002·0 cites·12 claims
- 0830US2002110618A1Apparatus having a moving mold clamping seat for high temperature fluid injection moldingFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →