Inventor · disambiguated record

Hsiao-Hua Peng

Also filed as: PENG HSIAO-HUA

3 granted patents·3 pending applications·5 citations·filing 2018–2024

58Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD6

Top patents by PatentIndex Score

6 records

0181US11062886B2Apparatus and method for controlling wafer uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·4 cites·18 claims
0267US11107708B2Heating platform, thermal treatment and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 31, 2021·1 cites·19 claims
0362US12142497B2Heating platform, thermal treatment and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
0456US2024387203A1Heating platform, thermal treatment and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0556US2021296100A1Apparatus and method for controlling wafer uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
0632US2019164852A1System and method for in-line processing controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →