Inventor · disambiguated record
Hsing Kuo Tien
Also filed as: TIEN HSING KUO
17 granted patents·1 pending application·74 citations·filing 2015–2025
90Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG18
Top patents by PatentIndex Score
18 records- 0197US9887167B1Embedded component package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 6, 2018·54 cites·21 claims
- 0294US11469186B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 11, 2022·3 cites·15 claims
- 0392US11239184B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 1, 2022·3 cites·20 claims
- 0487US11018120B2Semiconductor device package with stress buffering layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 25, 2021·4 cites·17 claims
- 0584US9997442B1Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jun 12, 2018·7 cites·27 claims
- 0682US2025273638A1Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0780US12300677B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·13 claims
- 0879US11062996B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 13, 2021·2 cites·22 claims
- 0971US12040287B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1071US11721678B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·17 claims
- 1170US11997798B2Package substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 28, 2024·0 cites·19 claims
- 1268US12315828B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 27, 2025·0 cites·18 claims
- 1367US11715694B2Embedded component package structure having a magnetically permeable layerADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 1, 2023·0 cites·12 claims
- 1463US11432406B2Package substrateADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·19 claims
- 1563US9721899B2Embedded component package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Aug 1, 2017·1 cites·13 claims
- 1661US11830834B2Semiconductor device, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 28, 2023·0 cites·17 claims
- 1751US10276507B2Embedded component package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 1850US11335650B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 17, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →