Inventor · disambiguated record
Hsien-Chou Tsai
Also filed as: TSAI HSIEN-CHOU
3 granted patents·1 citations·filing 2019–2020
47Inventor score
Technology areasH10W
Files withTSAI SHIANN-TSONG3
Top patents by PatentIndex Score
3 records- 0171US10923435B2Semiconductor package with in-package compartmental shielding and improved heat-dissipation performanceTSAI SHIANN TSONG·Filed 2020·Granted Feb 16, 2021·1 cites·14 claims
- 0243US10896880B2Semiconductor package with in-package compartmental shielding and fabrication method thereofTSAI SHIANN TSONG·Filed 2019·Granted Jan 19, 2021·0 cites·26 claims
- 0341US11211340B2Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shieldingTSAI SHIANN TSONG·Filed 2019·Granted Dec 28, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →