Inventor · disambiguated record
Hsiang-Wei Tseng
Also filed as: TSENG HSIANG-WEI
5 granted patents·1 pending application·100 citations·filing 1997–2013
81Inventor score
Top patents by PatentIndex Score
6 records- 0178US8488320B2Semiconductor package having a cooling fan and method of fabricating the sameTSENG HSIANG-WEI·Filed 2011·Granted Jul 16, 2013·7 cites·14 claims
- 0276US5985363AMethod of providing uniform photoresist coatings for tight control of image dimensionsVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted Nov 16, 1999·57 cites·21 claims
- 0368US8680672B2Semiconductor package with sleeve member and fan wheel for heat dissipationTSENG HSIANG-WEI·Filed 2012·Granted Mar 25, 2014·3 cites·15 claims
- 0466US6391737B1Method of simultaneously forming patterns on a die of an alignment mark and other diesVANGUARD INT SEMICONDUCT CORP·Filed 2000·Granted May 21, 2002·15 cites·16 claims
- 0549US5851877AMethod of forming a crown shape capacitorVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Dec 22, 1998·18 cites·19 claims
- 0638US2014041909A1Ceramic Substrate and Method for Reducing Surface Roughness of Metal Filled Via Holes ThereonECOCERA OPTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →