Inventor · disambiguated record
Hsien-Hua Tseng
Also filed as: TSENG HSIEN HUA
1 granted patent·2 pending applications·2 citations·filing 2002–2024
18Inventor score
Top patents by PatentIndex Score
3 records- 0153US2025351417A1Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0251US2024404871A1Methods for isolation process control and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0339US6755602B2Wafer transport pod with linear door opening mechanismTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 29, 2004·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →