Inventor · disambiguated record
Hsien-Ju Tsou
Also filed as: TSOU HSIEN-JU
14 granted patents·5 pending applications·36 citations·filing 2017–2025
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19
Top patents by PatentIndex Score
19 records- 0197US11456245B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0297US11296032B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·5 cites·20 claims
- 0392US10269589B2Method of manufacturing a release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 0491US11855003B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0591US10916450B2Package of integrated circuits having a light-to-heat-conversion coating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·6 cites·19 claims
- 0689US11164855B2Package structure with a heat dissipating element and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·6 cites·20 claims
- 0785US10510732B2PoP device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 0879US2024379617A1Shift control method in manufacture of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0977US2025343088A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1073US11139285B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·1 cites·20 claims
- 1172US12148733B2Shift control method in manufacture of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 1267US2023020959A1Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1363US10879194B2Semiconductor device package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 29, 2020·1 cites·20 claims
- 1462US11183482B2Shift control method in manufacture of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·8 claims
- 1555US2024178015A1Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1655US2024222292A1Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1754US10497690B2Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 3, 2019·0 cites·13 claims
- 1851US11205615B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 21, 2021·0 cites·20 claims
- 1949US10586763B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 10, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →