Inventor · disambiguated record

Hsien-Ming Tu

Also filed as: TU HSIEN-MING

35 granted patents·1 pending application·85 citations·filing 2013–2025

96Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD35 TAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

36 records

0196US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
0296US9627332B1Integrated circuit structure and seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·22 cites·20 claims
0390US10497646B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·5 cites·20 claims
0485US9947630B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
0585US9048149B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·6 cites·20 claims
0684US12261126B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 25, 2025·0 cites·20 claims
0784US2025323148A1Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0882US12322696B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
0982US12278199B2Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
1082US10354986B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·2 cites·20 claims
1182US9559044B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·20 claims
1281US10985121B2Bump structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·2 cites·20 claims
1381US9786618B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
1481US9461106B1MIM capacitor and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·4 cites·20 claims
1578US9852985B1Conductive terminal on integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·3 cites·20 claims
1678US9799615B1Package structures having height-adjusted molding members and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·3 cites·19 claims
1777US10269737B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
1875US10262958B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 16, 2019·1 cites·20 claims
1973US11837562B2Conductive bump of a semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
2073US11469200B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
2173US11107772B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
2273US10163828B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·2 cites·14 claims
2373US9484318B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·2 cites·19 claims
2472US11923318B2Method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
2564US11735518B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 22, 2023·0 cites·20 claims
2664US10825804B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
2762US10879198B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
2860US10854564B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
2958US9812434B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 7, 2017·0 cites·20 claims
3057US9343417B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·0 cites·21 claims
3156US10032737B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
3256US9679883B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
3349US9318456B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 19, 2016·0 cites·19 claims
3441US10062654B2Semicondcutor structure and semiconductor manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·0 cites·14 claims
3541US9943239B2Optical sensing system and associated electronic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·20 claims
3640US9748212B2Shadow pad for post-passivation interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →