Inventor · disambiguated record
Hsing-Hsiang Wang
Also filed as: WANG HSING MAW · WANG HSING-HSIANG
3 granted patents·5 pending applications·0 citations·filing 2002–2025
43Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
Top patents by PatentIndex Score
8 records- 0173US2025349762A1Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0267US2025054885A1Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0360US12219882B2Memory cell with low resistance top electrode contact and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 0460US2025143191A1Memory cell with low resistance top electrode contact and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0556US2022336228A1Metal etching with in situ plasma ashingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0649US11545619B2Memory device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 0748US11699596B2Metal etching with in situ plasma ashingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 11, 2023·0 cites·17 claims
- 0829US2003134581A1Device for chemical mechanical polishingFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hsing-Hsiang Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →