Inventor · disambiguated record
Hsiang-Wei Wang
Also filed as: WANG HSIANG WEI · WANG HSIANG Y
3 granted patents·1 pending application·27 citations·filing 2003–2022
66Inventor score
Top patents by PatentIndex Score
4 records- 0183US7323784B2Top via pattern for bond pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 29, 2008·14 cites·12 claims
- 0268US7087350B2Method for combining via patterns into a single maskTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 8, 2006·13 cites·2 claims
- 0340US2006046904A1TreadmillCHANG CHIH Y·Filed 2004·Application pending·0 cites
- 0428USD1050832SSecateursCHANG KUEI FANG·Filed 2022·Granted Nov 12, 2024·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →