Inventor · disambiguated record
Hsingjen Wann
Also filed as: WANN HSINGJEN
11 granted patents·1 pending application·151 citations·filing 1998–2019
90Inventor score
Top patents by PatentIndex Score
12 records- 0189US8716863B2Structure and method for high performance interconnectWANN HSINGJEN·Filed 2011·Granted May 6, 2014·18 cites·14 claims
- 0288US9105661B2Fin field effect transistor gate oxideHUANG GIN-CHEN·Filed 2011·Granted Aug 11, 2015·12 cites·9 claims
- 0385US7452784B2Formation of improved SOI substrates using bulk semiconductor wafersIBM·Filed 2006·Granted Nov 18, 2008·11 cites·1 claims
- 0485US6093947ARecessed-gate MOSFET with out-diffused source/drain extensionIBM·Filed 1998·Granted Jul 25, 2000·80 cites·8 claims
- 0578US8268698B2Formation of improved SOI substrates using bulk semiconductor wafersHENSON WILLIAM K·Filed 2011·Granted Sep 18, 2012·4 cites·9 claims
- 0673US9406518B2(110) surface orientation for reducing fermi-level-pinning between high-K dielectric and group III-V compound semiconductor substrateCHENG CHAO-CHING·Filed 2011·Granted Aug 2, 2016·3 cites·18 claims
- 0765US10964817B2(110) surface orientation for reducing fermi-level-pinning between high-K dielectric and group III-V compound semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 0859US6876040B1Dense SRAM cells with selective SOIIBM·Filed 2003·Granted Apr 5, 2005·8 cites·9 claims
- 0956US10770588B2(110) surface orientation for reducing fermi-level-pinning between high-K dielectric and group III-V compound semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 8, 2020·0 cites·20 claims
- 1054US7932158B2Formation of improved SOI substrates using bulk semiconductor wafersIBM·Filed 2008·Granted Apr 26, 2011·0 cites·14 claims
- 1150US6063699AMethods for making high-aspect ratio holes in semiconductor and its application to a gate damascene process for sub- 0.05 micron mosfetsIBM·Filed 1998·Granted May 16, 2000·15 cites·17 claims
- 1240US2013019219A1System and method for hierarchy reconstruction from flattened graphic database system layoutTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →