Inventor · disambiguated record

Hsin-Hsing Wei

Also filed as: WEI HSIN-HSING

1 granted patent·43 citations·filing 1999–1999

47Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG1

Top patents by PatentIndex Score

1 record

0168US6093960ASemiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performanceADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jul 25, 2000·43 cites·3 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →