Inventor · disambiguated record
Hsin-Chieh Yao
Also filed as: YAO HSIN-CHIEH
51 granted patents·25 pending applications·142 citations·filing 2010–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD63TAIWAN SEMICONDUCTOR MFG10TSAI CHENG-HSIUNG1TSAI TSUNG-JUNG1YAO HSIN-CHIEH1
Top patents by PatentIndex Score
76 records- 0198US9134633B2System and method for dark field inspectionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·63 cites·20 claims
- 0296US12424488B2Dual etch-stop layer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·2 cites·20 claims
- 0396US11798910B2Self-aligned interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·2 cites·20 claims
- 0495US11942364B2Selective deposition of a protective layer to reduce interconnect structure critical dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
- 0595US11362030B2Sidewall spacer structure enclosing conductive wire sidewalls to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0695US10847417B1Methods of forming interconnect structures in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·12 cites·20 claims
- 0794US9627206B2Method of double patterning lithography process using plurality of mandrels for integrated circuit applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·9 cites·20 claims
- 0892US11676862B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0991US11854965B2Sidewall spacer structure enclosing conductive wire sidewalls to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·1 cites·20 claims
- 1091US10170306B2Method of double patterning lithography process using plurality of mandrels for integrated circuit applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·5 cites·20 claims
- 1191US2025364401A1Sidewall spacer structure enclosing conductive wire sidewalls to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1290US11521896B2Selective deposition of a protective layer to reduce interconnect structure critical dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·2 cites·20 claims
- 1387US2025357206A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1486US2025349608A1Dual etch-stop layer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1585US11798840B2Self-assembled dielectric on metal RIE lines to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·18 claims
- 1685US11569127B2Double patterning approach by direct metal etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 1784US2025329638A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1883US9484257B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 1, 2016·3 cites·20 claims
- 1983US9134604B2Extreme ultraviolet (EUV) mask and method of fabricating the EUV maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 15, 2015·3 cites·20 claims
- 2083US2025316532A1Self-assembled dielectric on metal rie lines to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2183US2025266387A1Self-aligned interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2282US12322723B2Self-aligned interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 2382US9293413B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Mar 22, 2016·3 cites·20 claims
- 2482US8513821B2Overlay mark assistant featureYAO HSIN-CHIEH·Filed 2010·Granted Aug 20, 2013·7 cites·20 claims
- 2581US12362231B2Self-assembled dielectric on metal rie lines to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 2680US12315817B2Dielectric on wire structure to increase processing window for overlying viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 2780US2024088022A1Sidewall spacer structure enclosing conductive wire sidewalls to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2879US12476142B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2979US12125795B2Integrated chip with inter-wire cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 3079US9709905B2System and method for dark field inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·2 cites·20 claims
- 3179US2024371779A1Integrated chip with inter-wire cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3279US2025259932A1Dielectric on wire structure to increase processing window for overlying viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3378US12406924B2Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·18 claims
- 3478US12243775B2Double patterning approach by direct metal etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 3577US9490163B2Tapered sidewall conductive lines and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 8, 2016·4 cites·20 claims
- 3676US9093501B2Interconnection wires of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·3 cites·20 claims
- 3775US9209076B2Method of double patterning lithography process using plurality of mandrels for integrated circuit applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·2 cites·20 claims
- 3875US8778794B1Interconnection wires of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 15, 2014·3 cites·20 claims
- 3975US2025191973A1Double patterning approach by direct metal etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4075US2025191971A1Integrated chip with cavity structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4175US2024387383A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4275US2024371770A1Interconnect conductive structure comprising two conductive materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4374US12266565B2Integrated chip with an etch-stop layer forming a cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 4474US2024194523A1Selective deposition of a protective layer to reduce interconnect structure critical dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4574US2024282623A1Semiconductor device structure having air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4673US8890321B2Method of semiconducotr integrated circuit fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·2 cites·20 claims
- 4772US2025273515A1Semiconductor device structure with carbon-containing conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4872US2024145380A1Barrier structure on interconnect wire to increase processing window for overlying viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4971US11652054B2Dielectric on wire structure to increase processing window for overlying viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 5071US9330989B2System and method for chemical-mechanical planarization of a metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 3, 2016·2 cites·20 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hsin-Chieh Yao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →