Inventor · disambiguated record
Hsi-Ying Yuan
Also filed as: YUAN HSI-YING
4 granted patents·2 pending applications·6 citations·filing 2007–2020
64Inventor score
Files withCHIP WIN TECH CO LTD2ADVANCED CHIP ENG TECH INC1HOLIEN TECH CO LTD1YOUNGTEK ELECTRONICS CORP1YU CHAO CHING1
Top patents by PatentIndex Score
6 records- 0182US11145565B2Method of fabricating a chip package module with improve heat dissipation effectYOUNGTEK ELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·2 cites·15 claims
- 0266US7476565B2Method for forming filling paste structure of WL packageADVANCED CHIP ENG TECH INC·Filed 2007·Granted Jan 13, 2009·3 cites·16 claims
- 0354US10115673B1Embedded substrate package structureHOLIEN TECH CO LTD·Filed 2017·Granted Oct 30, 2018·1 cites·8 claims
- 0421US2018166390A1Planar package structure and manufacturing method thereofYU CHAO CHING·Filed 2016·Application pending·0 cites
- 0518US2017282186A1Structure for integrating microfluidic devices and optical biosensorsCHIP WIN TECH CO LTD·Filed 2016·Application pending·0 cites
- 0614US9810662B1Structure for integrating microfluidic devices and electrical biosensorsCHIP WIN TECH CO LTD·Filed 2017·Granted Nov 7, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →