Inventor · disambiguated record
Hsien Yu Tseng
Also filed as: YU TSENG HSIEN
7 granted patents·5 pending applications·10 citations·filing 2019–2025
77Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12
Top patents by PatentIndex Score
12 records- 0196US11288437B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·4 cites·20 claims
- 0292US10867109B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·6 cites·20 claims
- 0378US12265773B2Method and apparatus for electromigration evaluationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 0477US2024386179A1Method and apparatus for electromigration evaluationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0573US2025252244A1Methods and non-transitory computer-readable media for inter-metal dielectric reliability checkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0671US12242790B2Method and apparatus of electromigration checkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0771US2025190676A1Method and apparatus of electromigration checkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0867US11675950B2Method and apparatus for electromigration evaluationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 0964US12314652B2Methods and non-transitory computer-readable media for inter-metal dielectric reliability checkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 1060US11256847B2Method and apparatus of electromigration checkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 1156US2025362338A1Method and system for thermal-aware electromigration evaluation and circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1252US2025322139A1Method for estimating temperature information of integrated circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →