Inventor · disambiguated record
Hung-Pin Chang
Also filed as: CHANG HUNG J · CHANG HUNG T · CHANG HUNG-PIN
40 granted patents·28 pending applications·214 citations·filing 2003–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD34CHANG HUNG-PIN8TAIWAN SEMICONDUCTOR MFG8UNIV CALIFORNIA4YU CHEN-HUA3
Top patents by PatentIndex Score
68 records- 0197US11594420B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·3 cites·20 claims
- 0295US8513119B2Method of forming bump structure having tapered sidewalls for stacked diesCHANG HUNG-PIN·Filed 2008·Granted Aug 20, 2013·35 cites·12 claims
- 0395US8466059B2Multi-layer interconnect structure for stacked diesCHANG HUNG-PIN·Filed 2010·Granted Jun 18, 2013·32 cites·19 claims
- 0491US10163756B2Isolation structure for stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·11 cites·21 claims
- 0590US8580682B2Cost-effective TSV formationYANG KU-FENG·Filed 2010·Granted Nov 12, 2013·11 cites·18 claims
- 0689US8946742B2Semiconductor package with through silicon viasYU CHEN-HUA·Filed 2010·Granted Feb 3, 2015·7 cites·20 claims
- 0788US8853830B2System, structure, and method of manufacturing a semiconductor substrate stackCHANG HUNG-PIN·Filed 2008·Granted Oct 7, 2014·12 cites·30 claims
- 0887US9312225B2Bump structure for stacked diesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 12, 2016·7 cites·21 claims
- 0987US9293418B2Backside through vias in a bonded structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·7 cites·20 claims
- 1087US8319336B2Reduction of etch microloading for through silicon viasCHANG HUNG-PIN·Filed 2010·Granted Nov 27, 2012·8 cites·20 claims
- 1186US10163709B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·4 cites·20 claims
- 1284US9601410B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 21, 2017·4 cites·20 claims
- 1383US8841773B2Multi-layer interconnect structure for stacked diesCHANG HUNG-PIN·Filed 2012·Granted Sep 23, 2014·6 cites·20 claims
- 1483US7265647B2High isolation tunable MEMS capacitive switchUNIV CALIFORNIA·Filed 2005·Granted Sep 4, 2007·12 cites·15 claims
- 1581US12142485B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1681US10510604B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 1780US10978346B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 1880US10515933B2System, structure, and method of manufacturing a semiconductor substrate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·2 cites·20 claims
- 1980US8476116B2Reduction of etch microloading for through silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 2, 2013·4 cites·20 claims
- 2080US2024379374A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2179US2025357234A1PACKAGING OF DIES INCLUDING TSVs USING SACRIFICIAL CARRIERTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2278US2025329666A1Stress buffer in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2378US2025357367A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2478US2025329669A1Seal rings in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2578US2025343173A1Forming shallow trench for dicing and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2677US10269761B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 2777US7541898B2High isolation tunable MEMS capacitive switchUNIV CALIFORNIA·Filed 2007·Granted Jun 2, 2009·7 cites·17 claims
- 2876US8896127B2Via structure and via etching process of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 25, 2014·3 cites·20 claims
- 2975US8870409B2Light tubeDONGGUAN MASSTOP LIQUID CRYSTAL DISPLAY CO LTD·Filed 2013·Granted Oct 28, 2014·4 cites·14 claims
- 3074US8507940B2Heat dissipation by through silicon plugsYU CHEN-HUA·Filed 2010·Granted Aug 13, 2013·2 cites·20 claims
- 3174US8329578B2Via structure and via etching process of forming the sameCHANG HUNG-PIN·Filed 2010·Granted Dec 11, 2012·3 cites·20 claims
- 3272US10049931B2Method of manufacturing a semiconductor device including through silicon plugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·1 cites·20 claims
- 3371US10510603B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·1 cites·20 claims
- 3471US2024413102A1Forming shallow trench for dicing and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3571US2024413101A1Seal rings in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3671US2024413097A1Stress buffer in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3769US2024339370A1Packaging of Dies Including TSVs using Sacrificial CarrierTAIWAN SEMICONDUCTOR MANUFACTORING CO LTD·Filed 2023·Application pending·0 cites
- 3868US9728457B2System, structure, and method of manufacturing a semiconductor substrate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 8, 2017·1 cites·21 claims
- 3967US7084724B2MEMS fabrication on a laminated substrateUNIV CALIFORNIA·Filed 2003·Granted Aug 1, 2006·16 cites·21 claims
- 4065US11004832B2System, structure, and method of manufacturing a semiconductor substrate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 4164US8836085B2Cost-effective TSV formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 16, 2014·1 cites·19 claims
- 4263US10497619B2Method of manufacturing a semiconductor device including through silicon plugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 4363US9978607B2Through via structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 22, 2018·1 cites·20 claims
- 4462US11688639B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 27, 2023·0 cites·20 claims
- 4561US7884689B2MEMS fabrication on a laminated substrateUNIV CALIFORNIA·Filed 2006·Granted Feb 8, 2011·3 cites·14 claims
- 4660US2024421111A1Device package with heterogeneous die structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4760US2024421077A1Die stitching for stacking architecture in semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4858US2024379482A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4958US2025285930A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5058US2025233034A1Semiconductor structure with capping layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →