Inventor · disambiguated record
Huang-Nan Chen
Also filed as: CHEN HUANG-NAN
10 granted patents·4 pending applications·9 citations·filing 2018–2024
81Inventor score
Files withWINBOND ELECTRONICS CORP14
Top patents by PatentIndex Score
14 records- 0186US11335569B2Conductive wire structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted May 17, 2022·2 cites·14 claims
- 0283US10872811B2Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Dec 22, 2020·3 cites·8 claims
- 0380US10910380B2Method of manufacturing dynamic random access memoryWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 2, 2021·2 cites·14 claims
- 0478US10714483B2Memory devices and methods for fabricating the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Jul 14, 2020·2 cites·5 claims
- 0563US11823950B2Memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 21, 2023·0 cites·13 claims
- 0663US11804381B2Conductive wire structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 31, 2023·0 cites·16 claims
- 0760US2024268100A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0859US10923479B2Method for fabricating a memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Feb 16, 2021·0 cites·15 claims
- 0959US2021210382A1Method for forming contact structureWINBOND ELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 1056US11917811B2Dynamic random access memory and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Feb 27, 2024·0 cites·18 claims
- 1151US2019019795A1Dynamic random access memory and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1250US2020043785A1A contact structure having a first liner and a second liner formed between a conductive element and a insulating layerWINBOND ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1347US10892323B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 1440US11211386B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Dec 28, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →