Inventor · disambiguated record
Huibin Chen
Also filed as: CHEN HUIBIN
10 granted patents·11 pending applications·9 citations·filing 2018–2024
81Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC9HUAWEI DIGITAL POWER TECH CO LTD6HUAWEI TECH CO LTD4XIEXUN ELECTRONIC JIAN CO LTD2
Top patents by PatentIndex Score
21 records- 0188US10566713B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 18, 2020·5 cites·18 claims
- 0283US10991670B2Semiconductor device assemblies including spacer with embedded semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 27, 2021·3 cites·21 claims
- 0381US11935817B2Power device module with dummy pad die layoutSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 19, 2024·1 cites·20 claims
- 0472US2024222231A1Power device module with dummy pad die layoutSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0567US12119576B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 15, 2024·0 cites·20 claims
- 0667US11594510B2Assembly processes for semiconductor device assemblies including spacer with embedded semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 0766US10804626B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 13, 2020·0 cites·20 claims
- 0863US2025118617A1Power module and manufacturing method thereforHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 0961US2025070055A1Power module, power supply system, vehicle, and photovoltaic systemHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 1059US2024312895A1Power module and vehicle-mounted power circuitHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 1159US2024170439A1Power module, power supply circuit, and chipHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1258US2025079387A1Power module and power conversion apparatusHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 1357US12322678B2Encapsulation structure and encapsulation method of power moduleHUAWEI TECH CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1457US2023395556A1Packaged structure, electric power control system, and manufacturing methodHUAWEI DIGITAL POWER TECH CO LTD·Filed 2023·Application pending·0 cites
- 1553US2024006330A1High-symmetrical semiconductor arrangementHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 1652US10553517B2High power module semiconductor package with multiple submodulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 4, 2020·0 cites·17 claims
- 1751US11127651B2High power module semiconductor package with multiple submodulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 21, 2021·0 cites·17 claims
- 1851US2023230928A1Substrate, packaged structure, and electronic deviceHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 1950US2024354482A1Method and apparatus for designing substrate of power module, and terminal deviceHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 2044US2025015616A1Charging apparatus supporting a bidirectional switching circuitXIEXUN ELECTRONIC JIAN CO LTD·Filed 2024·Application pending·0 cites
- 2135USD1079658SData cableXIEXUN ELECTRONIC JIAN CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →