Inventor · disambiguated record
Huei-Shyong Cho
Also filed as: CHO HUEI-SHYONG
17 granted patents·9 pending applications·15 citations·filing 2017–2025
89Inventor score
Files withADVANCED SEMICONDUCTOR ENG26
Top patents by PatentIndex Score
26 records- 0190US10546825B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 28, 2020·6 cites·11 claims
- 0286US11037891B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·3 cites·17 claims
- 0383US2025038136A1Device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0482US10530038B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 7, 2020·3 cites·24 claims
- 0580US12206165B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0680US12119312B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 15, 2024·0 cites·10 claims
- 0775US10199336B2Antenna package deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 5, 2019·2 cites·22 claims
- 0875US2025167440A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0974US11018422B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 25, 2021·1 cites·22 claims
- 1072US11705412B2Device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 1172US11670846B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 6, 2023·0 cites·13 claims
- 1269US12381331B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Aug 5, 2025·0 cites·19 claims
- 1368US12444848B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 14, 2025·0 cites·9 claims
- 1467US12424762B2Antenna package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Sep 23, 2025·0 cites·16 claims
- 1560US11329007B2Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 10, 2022·0 cites·17 claims
- 1660US10847481B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 1759US2025385422A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1858US2025149457A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1957US11997783B2Electronic devicesADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 28, 2024·0 cites·6 claims
- 2057US10790241B2Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 29, 2020·0 cites·31 claims
- 2156US2024357751A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2253US2024038678A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 2353US2025087887A1Antenna moduleADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2451US2024347909A1Antenna package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2550US11108131B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 31, 2021·0 cites·28 claims
- 2642US2020279804A1Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →