Inventor · disambiguated record
Hung-Yu Chou
Also filed as: CHOU HUNG-YU
14 granted patents·7 pending applications·64 citations·filing 2000–2024
86Inventor score
Top patents by PatentIndex Score
21 records- 0187US6757012B1Color selection for sparse color image reconstructionBIOMORPHIC VLSI INC·Filed 2000·Granted Jun 29, 2004·51 cites·40 claims
- 0284US7612506B1Method for controlling light-emission of a light-emitting diode light sourceUNIV NAT CENTRAL·Filed 2008·Granted Nov 3, 2009·13 cites·4 claims
- 0370US12040197B2Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 16, 2024·0 cites·17 claims
- 0470US2024274570A1Stud bump for wirebonding high voltage isolation barrier connectionTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0570US2024274569A1Integrated circuit die pad cavityTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0666US11942448B2Integrated circuit die pad cavityTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·23 claims
- 0765US2024413268A1Semiconductor deviceEPISTAR CORP·Filed 2024·Application pending·0 cites
- 0863US11973052B2Stud bump for wirebonding high voltage isolation barrier connectionTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0957US10429174B2Single wavelength reflection for leadframe brightness measurementTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 1, 2019·0 cites·27 claims
- 1055US10340152B1Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 2, 2019·0 cites·9 claims
- 1155US2024113155A1Wire bonds for galvanic isolation deviceTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1254US2019326131A1Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 1353US11735506B2Packages with multiple exposed padsTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 22, 2023·0 cites·30 claims
- 1452US11862538B2Semiconductor die mounted in a recess of die padTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1552US11421981B2Single wavelength reflection for leadframe brightness measurementTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 23, 2022·0 cites·16 claims
- 1650US11848297B2Semiconductor device packages with high angle wire bonding and non-gold bond wiresTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 1748US11742265B2Exposed heat-generating devicesTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 29, 2023·0 cites·16 claims
- 1847US2010066270A1Control method for maintaining the luminous intensity of a light-emitting diode light sourceUNIV NAT CENTRAL·Filed 2008·Application pending·0 cites
- 1946US2023317571A1Lead finger with z-direction obstruction featureTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2041US11948721B2Packaged isolation barrier with integrated magneticsTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 2, 2024·0 cites·20 claims
- 2141US10861777B2Wire bond clamp design and lead frame capable of engaging with sameTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 8, 2020·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →