Inventor · disambiguated record
Huiyang Fei
Also filed as: FEI HUIYANG
4 granted patents·1 pending application·9 citations·filing 2014–2021
68Inventor score
Technology areasH10W
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0177US10256198B2Warpage control for microelectronics packagesINTEL CORP·Filed 2017·Granted Apr 9, 2019·2 cites·21 claims
- 0275US9633937B2Electronic assembly that includes stacked electronic devicesINTEL CORP·Filed 2014·Granted Apr 25, 2017·5 cites·15 claims
- 0369US10231338B2Methods of forming trenches in packages structures and structures formed therebyINTEL CORP·Filed 2015·Granted Mar 12, 2019·2 cites·23 claims
- 0464US2021391281A1Warpage control for microelectronics packagesINTEL CORP·Filed 2021·Application pending·0 cites
- 0558US11114388B2Warpage control for microelectronics packagesINTEL CORP·Filed 2019·Granted Sep 7, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →