Inventor · disambiguated record
Hui Wen Goh
Also filed as: GOH HUI WEN
0 granted patents·3 pending applications·0 citations·filing 2022–2024
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0156US2025201754A1Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between themINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0250US2024170374A1Semiconductor Package with Current SensingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 0347US2025286012A1Semiconductor package having a ball-bond interconnect structure and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →