Inventor · disambiguated record
Huang-Ting Hsiao
Also filed as: HSIAO HUANG-TING
4 granted patents·1 pending application·10 citations·filing 2005–2018
69Inventor score
Top patents by PatentIndex Score
5 records- 0184US9454684B2Edge crack detection systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·6 cites·16 claims
- 0277US9880220B2Edge crack detection systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·2 cites·20 claims
- 0369US11018099B2Semiconductor structure having a conductive bump with a plurality of bump segmentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 25, 2021·2 cites·20 claims
- 0455US11495556B2Semiconductor structure having counductive bump with tapered portions and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 8, 2022·0 cites·20 claims
- 0531US2007068846A1Wafer packingHSIAO HUANG-TING·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Huang-Ting Hsiao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →