Inventor · disambiguated record
Huei-Wen Hsieh
Also filed as: HSIEH HUEI-WEN
8 granted patents·3 pending applications·2 citations·filing 2020–2024
76Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11
Top patents by PatentIndex Score
11 records- 0186US11854878B2Bi-layer alloy liner for interconnect metallization and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·2 cites·20 claims
- 0278US12354910B2Bi-layer alloy liner for interconnect metallization and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0376US2024395617A1Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF FORMING THE SAMETAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0474US2024350289A1Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0573US12347728B2Bi-layer alloy liner for interconnect metallization and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0672US12080594B2Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 0772US2024387256A1Ruthenium-based liner for a copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0868US12400862B2Interconnect structures and methods and apparatuses for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0967US11430692B2Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 1066US12094770B2Ruthenium-based liner for a copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 1161US11694899B2Interconnect structures and methods and apparatuses for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →