Inventor · disambiguated record
Hungen Hsu
Also filed as: HSU HUNGEN
1 granted patent·2 pending applications·2 citations·filing 2021–2024
20Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0182US12040266B2Package substrate, package using the same, and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·2 cites·20 claims
- 0263US2024274522A1Package substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0350US2025391757A1Substrate design for semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →