Inventor · disambiguated record
Huai-Jen Hsu
Also filed as: HSU HUAI-JEN
3 granted patents·61 citations·filing 2002–2002
73Inventor score
Files withTAIWAN SEMICONDUCTOR MFG3
Top patents by PatentIndex Score
3 records- 0176US6709965B1Aluminum-copper bond pad design and method of fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 23, 2004·35 cites·30 claims
- 0262US6677228B1Reinforced aluminum copper bonding padTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 13, 2004·16 cites·30 claims
- 0360US6927345B2Guard ring having electrically isolated lightening barsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 9, 2005·10 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Huai-Jen Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →