Inventor · disambiguated record
Hung-En Hsu
Also filed as: HSU HUNG EN
2 granted patents·5 pending applications·5 citations·filing 2005–2024
44Inventor score
Files withHSU HUNG-EN2TAIWAN SEMICONDUCTOR MFG CO LTD2NAN YA PRINTED CIRCUIT BOARD1NAN YA PRINTED CIRCUIT BOARD C1TSAI TZONG-WOEI1
Top patents by PatentIndex Score
7 records- 0165US7524429B2Method of manufacturing double-sided printed circuit boardNAN YA PRINTED CIRCUIT BOARD C·Filed 2006·Granted Apr 28, 2009·5 cites·6 claims
- 0255US2025385170A1Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0352US2025118695A1Package component and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0440US2008035271A1Method for forming micro blind via on a copper clad laminate substrate utilizing laser drilling techniqueHSU HUNG-EN·Filed 2006·Application pending·0 cites
- 0538US2009026168A1Method for manufacturing a rigid-flex circuit boardTSAI TZONG-WOEI·Filed 2007·Application pending·0 cites
- 0635US7877873B2Method for forming a wire bonding substrateNAN YA PRINTED CIRCUIT BOARD·Filed 2008·Granted Feb 1, 2011·0 cites·10 claims
- 0729US2006054588A1Method of Manufacturing Double-Sided Printed Circuit BoardHSU HUNG-EN·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hung-En Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →