Inventor · disambiguated record
Hui-Ping Jian
Also filed as: JIAN HUI-PING
2 granted patents·1 pending application·1 citations·filing 2020–2025
32Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0174US11302647B2Semiconductor device package including conductive layers as shielding and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 12, 2022·1 cites·18 claims
- 0257US2025218978A1Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0355US12237272B2Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 25, 2025·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Hui-Ping Jian files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →