Inventor · disambiguated record
Huifang Jiao
Also filed as: JIAO HUIFANG
2 granted patents·2 pending applications·0 citations·filing 2021–2025
22Inventor score
Files withHUAWEI TECH CO LTD4
Top patents by PatentIndex Score
4 records- 0156US2025291484A1Memory Mapping Method and Related DeviceHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 0250US2024178167A1Chip package structure and method for preparing chip package structureHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0347US11756922B2Hybrid bonding structure and hybrid bonding methodHUAWEI TECH CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0436US12183425B2Data reading/writing method, memory, storage apparatus, and terminalHUAWEI TECH CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →