Inventor · disambiguated record
Huan En Ku
Also filed as: KU HUAN EN
1 granted patent·1 pending application·0 citations·filing 2020–2023
11Inventor score
Top patents by PatentIndex Score
2 records- 0150US11855608B2Systems and methods for packaging an acoustic device in an integrated circuit (IC)RF360 SINGAPORE PTE LTD·Filed 2020·Granted Dec 26, 2023·0 cites·36 claims
- 0240US2025096164A1Die package with guard structure to reduce or prevent material seepage into air cavity, and related fabrication methodsQUALCOMM TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →