Inventor · disambiguated record
Hung-Chun Kuo
Also filed as: KUO HUNG-CHUN
9 granted patents·12 pending applications·5 citations·filing 2016–2025
77Inventor score
Files withADVANCED SEMICONDUCTOR ENG21
Top patents by PatentIndex Score
21 records- 0176US11232998B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 25, 2022·3 cites·22 claims
- 0270US10014268B2Semiconductor chip, semiconductor device and manufacturing process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jul 3, 2018·2 cites·18 claims
- 0366US2025054829A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0465US2024282694A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0564US12156336B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 0662US12211780B2Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jan 28, 2025·0 cites·13 claims
- 0762US11973018B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Apr 30, 2024·0 cites·13 claims
- 0860US12131972B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 29, 2024·0 cites·7 claims
- 0958US2025174536A1Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1055US11991827B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 21, 2024·0 cites·17 claims
- 1152US11990385B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 21, 2024·0 cites·8 claims
- 1252US2025029970A1Electronic device and chiplet moduleADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1351US2025038084A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1450US2025096073A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1549US2024329344A1Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1649US2024332192A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1749US2024329300A1Package device and electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1849US2024345341A1Package deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1948US2024345315A1Optoelectronic packageADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2046US11328999B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 10, 2022·0 cites·20 claims
- 2133US2018052281A1Substrate, semiconductor device and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →