Inventor · disambiguated record

Hu-Kong Lai

Also filed as: LAI HU-KONG

3 granted patents·349 citations·filing 1995–1996

78Inventor score

Technology areasH10W

Files withACC MICROELECTRONICS CORP3

Top patents by PatentIndex Score

3 records

0192US5801440AChip package board having utility ringsACC MICROELECTRONICS CORP·Filed 1995·Granted Sep 1, 1998·238 cites·22 claims
0280US5686699ASemiconductor board providing high signal pin utilizationACC MICROELECTRONICS CORP·Filed 1996·Granted Nov 11, 1997·75 cites·19 claims
0364US5703402AOutput mapping of die pad bonds in a ball grid arrayACC MICROELECTRONICS CORP·Filed 1995·Granted Dec 30, 1997·36 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →