Inventor · disambiguated record

Hu Ah Lek

Also filed as: LEK HU AH

7 granted patents·61 citations·filing 2000–2004

81Inventor score

Technology areasH10W

Files withNAT SEMICONDUCTOR CORP7

Top patents by PatentIndex Score

7 records

0183US6448107B1Pin indicator for leadless leadframe packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·39 cites·16 claims
0264US6677667B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jan 13, 2004·11 cites·34 claims
0362US6576989B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 10, 2003·10 cites·21 claims
0444US6808961B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Oct 26, 2004·1 cites·24 claims
0540US6818970B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 16, 2004·0 cites·22 claims
0638US6963124B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Nov 8, 2005·0 cites·22 claims
0738US6933174B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·0 cites·27 claims

Join the waitlist — get patent alerts

Get an alert when Hu Ah Lek files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →