Inventor · disambiguated record
Hui Min Ler
Also filed as: LER HUI MIN
5 granted patents·4 pending applications·1 citations·filing 2015–2025
67Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC9
Top patents by PatentIndex Score
9 records- 0186US2025118635A1Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0284US11532539B2Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 20, 2022·1 cites·8 claims
- 0380US12243810B2Semiconductor package with wettable flank and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0480US12176272B2Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 0579US2025201675A1Semiconductor package with wettable flank and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0659US11557530B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
- 0755US2025022831A1Semiconductor packages with wettable flanks and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0841US10727170B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Jul 28, 2020·0 cites·20 claims
- 0929US2018090421A1Long-lasting wettable flanksSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →