Inventor · disambiguated record
Hung-Chi Li
Also filed as: LI HUNG-CHI
14 granted patents·4 pending applications·44 citations·filing 2017–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18
Top patents by PatentIndex Score
18 records- 0198US11594469B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·6 cites·20 claims
- 0295US10475877B1Multi-terminal inductor for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·6 cites·20 claims
- 0395US10461014B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·10 cites·23 claims
- 0491US10515867B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·6 cites·17 claims
- 0590US10978373B2Semiconductor device methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·5 cites·19 claims
- 0687US11018073B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·3 cites·20 claims
- 0784US10153218B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·4 cites·20 claims
- 0882US11088048B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0981US2025323121A1Semiconductor package and manufacturing method thereoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US12412805B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·12 claims
- 1178US11282766B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·1 cites·20 claims
- 1278US2025357258A1Electronic apparatus, semiconductor package module and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1374US10672860B2Multi-terminal inductor for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 2, 2020·1 cites·20 claims
- 1472US11587845B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 1572US2023144244A1Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1667US11996342B2Semiconductor package comprising heat dissipation platesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1767US10879342B2Multi-terminal inductor for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 1863US2023075909A1Electronic apparatus, semiconductor package module and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hung-Chi Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →