Inventor · disambiguated record
Hung-Wei Liang
Also filed as: LIANG HUNG-WEI
6 granted patents·1 pending application·2 citations·filing 2019–2025
70Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
Top patents by PatentIndex Score
7 records- 0185US11772960B2Method of forming dielectric and metal sealing layers on capping structure of a MEMs deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
- 0282US2025333295A1Micro-electromechanical systems (mems) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0381US12202724B2Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent holeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0476US10961114B2Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 0570US12441604B2Micro-electromechanical systems (MEMS) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0670US12074110B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 0753US11462478B2Layer for buffer semiconductor device including microelectromechnical system (MEMS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 4, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →