Inventor · disambiguated record
Hung-Kwei Liao
Also filed as: LIAO HUNG-KWEI
13 granted patents·4 pending applications·90 citations·filing 1999–2022
87Inventor score
Files withPOWERCHIP SEMICONDUCTOR MFG CORP7PROMOS TECHNOLOGIES INC6NAT SCIENCE COUNCIL2POWERCHIP TECH CORP1
Top patents by PatentIndex Score
17 records- 0183US6703273B2Aggressive capacitor array cell layout for narrow diameter DRAM trench capacitor structures via SOI technologyPROMOS TECHNOLOGIES INC·Filed 2002·Granted Mar 9, 2004·45 cites·27 claims
- 0263US6218208B1Fabrication of a multi-structure ion sensitive field effect transistor with a pH sensing layer of a tin oxide thin filmNAT SCIENCE COUNCIL·Filed 1999·Granted Apr 17, 2001·25 cites·11 claims
- 0356US11915969B2Semiconductor structure and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2022·Granted Feb 27, 2024·0 cites·18 claims
- 0456US7427569B2Metal etching process and rework method thereofPROMOS TECHNOLOGIES INC·Filed 2006·Granted Sep 23, 2008·1 cites·16 claims
- 0553US6734106B2Method of buried strap out-diffusion formation by gas phase dopingPROMOS TECHNOLOGIES INC·Filed 2002·Granted May 11, 2004·7 cites·30 claims
- 0648US11171217B1Memory structure and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Nov 9, 2021·0 cites·18 claims
- 0748US7485917B2Split gate flash memory cell and fabrication method thereofPROMOS TECHNOLOGIES INC·Filed 2006·Granted Feb 3, 2009·1 cites·20 claims
- 0845US6236075B1Ion sensitive transistorNAT SCIENCE COUNCIL·Filed 1999·Granted May 22, 2001·11 cites·10 claims
- 0944US11189715B2Semiconductor device and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Nov 30, 2021·0 cites·4 claims
- 1041US10777652B2Semiconductor device and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Sep 15, 2020·0 cites·15 claims
- 1141US7535050B2Memory structure with high coupling ratioPROMOS TECHNOLOGIES INC·Filed 2005·Granted May 19, 2009·0 cites·12 claims
- 1241US2021358934A1Non-volatile memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Application pending·0 cites
- 1340US10784259B2Semiconductor device and method of manufacturing the samePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Sep 22, 2020·0 cites·9 claims
- 1439US2008102577A1Method for Preparing a Trench Capacitor StructurePROMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1536US2021359113A1Transistor and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Application pending·0 cites
- 1633US2003045119A1Method for forming a bottle-shaped trenchFiled 2001·Application pending·0 cites
- 1732US9437715B1Non-volatile memory and manufacturing method thereofPOWERCHIP TECH CORP·Filed 2015·Granted Sep 6, 2016·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →