Inventor · disambiguated record
Hung-Chih Lin
Also filed as: LIN HUNG · LIN HUNG CHIH
98 granted patents·25 pending applications·301 citations·filing 2005–2024
99Inventor score
Top patents by PatentIndex Score
123 records- 0197US9664707B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
- 0297US9453877B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 27, 2016·9 cites·20 claims
- 0397US9341671B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·14 cites·20 claims
- 0496US10067181B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·5 cites·20 claims
- 0595US9086452B2Three-dimensional integrated circuit and method for wireless information access thereofWANG MILL-JER·Filed 2012·Granted Jul 21, 2015·26 cites·20 claims
- 0694US10698026B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·20 claims
- 0794US10652987B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·5 cites·20 claims
- 0893US10282814B2Method and apparatus of image formation and compression of cubic images for 360 degree panorama displayMEDIATEK INC·Filed 2016·Granted May 7, 2019·11 cites·20 claims
- 0993US8957691B2Probe cards for probing integrated circuitsWANG MILL-JER·Filed 2011·Granted Feb 17, 2015·12 cites·22 claims
- 1092US11340291B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 1191US8922230B23D IC testing apparatusWANG MILL-JER·Filed 2011·Granted Dec 30, 2014·10 cites·14 claims
- 1290US9372227B2Integrated circuit test system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 21, 2016·10 cites·17 claims
- 1390US8294844B2Liquid crystal display and assembly method of the sameCHEN LI-YI·Filed 2010·Granted Oct 23, 2012·14 cites·19 claims
- 1489US8421073B2Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2011·Granted Apr 16, 2013·10 cites·20 claims
- 1588US10380715B2Method and apparatus for generating and encoding projection-based frame with 360-degree content represented by triangular projection faces packed in octahedron projection layoutMEDIATEK INC·Filed 2017·Granted Aug 13, 2019·6 cites·18 claims
- 1687US10560678B2Method and apparatus having video encoding function with syntax element signaling of rotation information of content-oriented rotation applied to 360-degree image content or 360-degree video content represented in projection format and associated method and apparatus having video decoding functionMEDIATEK INC·Filed 2017·Granted Feb 11, 2020·4 cites·5 claims
- 1787US10368067B2Method and apparatus for selective filtering of cubic-face framesMEDIATEK INC·Filed 2017·Granted Jul 30, 2019·4 cites·11 claims
- 1886US10073135B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·2 cites·20 claims
- 1986US9900970B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·2 cites·19 claims
- 2086US9252593B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Feb 2, 2016·4 cites·15 claims
- 2185US10264282B2Method and apparatus of inter coding for VR video using virtual reference framesMEDIATEK INC·Filed 2017·Granted Apr 16, 2019·4 cites·19 claims
- 2285US9754847B2Circuit probing structures and methods for probing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·4 cites·20 claims
- 2385US9671457B23D IC testing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·5 cites·18 claims
- 2485US9658281B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·4 cites·20 claims
- 2585US7217005B2Light emitting diode lamp moduleGRAND MOTOMO LIGHTS CO LTD·Filed 2005·Granted May 15, 2007·34 cites·12 claims
- 2684US10462484B2Video encoding method and apparatus with syntax element signaling of employed projection layout and associated video decoding method and apparatusMEDIATEK INC·Filed 2017·Granted Oct 29, 2019·5 cites·20 claims
- 2784US9923387B2Multi-mode wireless receiver apparatus and resonator circuit designMEDIATEK INC·Filed 2015·Granted Mar 20, 2018·4 cites·12 claims
- 2884US9859176B1Semiconductor device, test system and method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·4 cites·20 claims
- 2983US8573811B2Backlight module with heat dissipating element and heat sinkLIN HUNG-CHIH·Filed 2011·Granted Nov 5, 2013·7 cites·4 claims
- 3082US11579190B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 14, 2023·0 cites·20 claims
- 3182US10641819B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·1 cites·20 claims
- 3282US9568543B2Structure and method for testing stacked CMOS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·5 cites·18 claims
- 3380US10614609B2Method and apparatus for reduction of artifacts at discontinuous boundaries in coded virtual-reality imagesMEDIATEK INC·Filed 2018·Granted Apr 7, 2020·2 cites·11 claims
- 3480US8866488B2Power compensation in 3DIC testingWANG MILL-JER·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 3580US7394212B2Inverter and inverter unit thereofAU OPTRONICS CORP·Filed 2007·Granted Jul 1, 2008·9 cites·24 claims
- 3679US9817029B2Test probing structureWANG MILL-JER·Filed 2011·Granted Nov 14, 2017·4 cites·20 claims
- 3779US8297827B2Backlight moduleHUANG MING-FENG·Filed 2011·Granted Oct 30, 2012·5 cites·10 claims
- 3878US11852672B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3978US9653927B2Composite integrated circuits and methods for wireless interactions therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·2 cites·20 claims
- 4077US9417285B2Integrated fan-out package-on-package testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·4 cites·17 claims
- 4176US10643370B2Method and apparatus for generating projection-based frame with 360-degree image content represented by triangular projection faces assembled in octahedron projection layoutMEDIATEK INC·Filed 2017·Granted May 5, 2020·2 cites·20 claims
- 4276US9891266B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·2 cites·20 claims
- 4375US8956889B2Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2013·Granted Feb 17, 2015·3 cites·20 claims
- 4474US11029331B2Universal test mechanism for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 8, 2021·2 cites·20 claims
- 4574US10593012B2Method and apparatus for generating and encoding projection-based frame with 360-degree content represented in projection faces packed in segmented sphere projection layoutMEDIATEK INC·Filed 2018·Granted Mar 17, 2020·2 cites·18 claims
- 4673US10134522B2Planar reactorCYNTEC CO LTD·Filed 2016·Granted Nov 20, 2018·1 cites·23 claims
- 4773US8324837B2Parallel light-emitting circuit of parallel LED light-emitting device and circuit board thereofLIN HUNG·Filed 2009·Granted Dec 4, 2012·6 cites·2 claims
- 4872US11387683B2Composite integrated circuits and methods for wireless interactions therewithTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 4972US11231453B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 5071US11467203B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hung-Chih Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →