Inventor · disambiguated record
Hung-Wen Lin
Also filed as: LIN HUNG WEN (KEVIN) · LIN HUNG-WEN
28 granted patents·4 pending applications·69 citations·filing 2004–2025
94Inventor score
Top patents by PatentIndex Score
32 records- 0196US12472567B1Tool connectorLIN HUNG WEN·Filed 2025·Granted Nov 18, 2025·1 cites·9 claims
- 0292US11744045B2Electronic device comprising a thermally conductive connector comprising graphiteQUALCOMM INC·Filed 2021·Granted Aug 29, 2023·7 cites·19 claims
- 0389US9313389B2Camera assembly and electronic deviceHTC CORP·Filed 2013·Granted Apr 12, 2016·9 cites·17 claims
- 0487US7188966B1Hand tool with illuminatorLIN HUNG WEN·Filed 2006·Granted Mar 13, 2007·23 cites·9 claims
- 0581US9939858B2Electronic deviceHTC CORP·Filed 2015·Granted Apr 10, 2018·4 cites·13 claims
- 0674US11637051B2Integrated device coupled to a step heat sink configured to provide shieldingQUALCOMM INC·Filed 2020·Granted Apr 25, 2023·1 cites·30 claims
- 0773US12508909B2Electronic device provided on transport deviceCARUX TECH PTE LTD·Filed 2024·Granted Dec 30, 2025·0 cites·14 claims
- 0865US9867312B2Electronic module and heat dissipation moduleHTC CORP·Filed 2013·Granted Jan 9, 2018·2 cites·11 claims
- 0964US9055206B1Electronic deviceHTC CORP·Filed 2013·Granted Jun 9, 2015·1 cites·10 claims
- 1064US8465169B2Driving shaft mechanism for ratchet wrenchLIN HUNG-WEN·Filed 2010·Granted Jun 18, 2013·3 cites·8 claims
- 1163US9335801B2Frame and electronic device having the sameHTC CORP·Filed 2014·Granted May 10, 2016·1 cites·20 claims
- 1262US8747262B1Jointed batLIN HUNG-WEN·Filed 2012·Granted Jun 10, 2014·4 cites·7 claims
- 1362US2024238268A1Treatments and methods for treating alzheimer's diseaseUNIV LOUISIANA STATE·Filed 2022·Application pending·0 cites
- 1461US7780307B2Illimination control apparatus for hand toolSHIN YUEH HANDTOOL CO LTD·Filed 2008·Granted Aug 24, 2010·5 cites·11 claims
- 1561US7755714B2LCD apparatus having a display module with pivot portion on back side spaced a predetermined distance from bottom edge that engages supporter and rotates to first or second position depending upon contact with table or wall type surfaceCHI MEI OPTOELECTRONICS CORP·Filed 2007·Granted Jul 13, 2010·2 cites·18 claims
- 1658US12107630B2Optical network method and apparatus of the sameREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Oct 1, 2024·0 cites·18 claims
- 1755US2024294123A1Electronic deviceCARUX TECH PTE LTD·Filed 2024·Application pending·0 cites
- 1852US9728352B2Switch structure and electronic device using the sameHTC CORP·Filed 2014·Granted Aug 8, 2017·0 cites·20 claims
- 1950US11733749B2Electronic device comprising thermally conductive connectorQUALCOMM INC·Filed 2020·Granted Aug 22, 2023·0 cites·14 claims
- 2050US11264355B2Method of manufacturing die package structureCOMCHIP TECH CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 2149US11302664B2Method of manufacturing die package structureCOMCHIP TECH CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·10 claims
- 2248US11026003B2Optical network unit and method for transmitting dynamic bandwidth report upstream informationREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Jun 1, 2021·0 cites·20 claims
- 2348US10910268B2Method of manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·10 claims
- 2448USD523827SLCD televisionQUANTA COMP INC·Filed 2004·Granted Jun 27, 2006·6 cites·1 claims
- 2547US10777461B2Method for manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·4 claims
- 2647US10665509B2Method for manufacturing chip packagesCOMCHIP TECH CO LTD·Filed 2019·Granted May 26, 2020·0 cites·9 claims
- 2746US12260315B2Device, method and storage medium for accelerating activation functionHON HAI PREC IND CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·20 claims
- 2846US10937760B2Method for manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·9 claims
- 2944US2014160641A1Electronic apparatusHTC CORP·Filed 2012·Application pending·0 cites
- 3041US10950502B2Method of manufacturing a chip packageCOMCHIP TECH CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·11 claims
- 3137US2005140486A1Multi-layer chip inductive elementFiled 2004·Application pending·0 cites
- 3221US10063236B2Low-voltage differential signaling transmitter and receiverUNIV YUAN ZE·Filed 2016·Granted Aug 28, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →