Inventor · disambiguated record
Hua-Kai Lin
Also filed as: LIN HUA-KAI
0 granted patents·3 pending applications·0 citations·filing 2024–2025
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0172US2025323126A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0269US2025125224A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0361US2025300053A1Semiconductor dies having electrical isolation layers and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →