Inventor · disambiguated record
Hung-Jen Lin
Also filed as: LIN HUNG-JEN
35 granted patents·5 pending applications·259 citations·filing 2002–2024
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23TAIWAN SEMICONDUCTOR MFG5AVISION INC4ADVANCED MICRO DEVICES INC2WANG TSUNG-DING2
Top patents by PatentIndex Score
40 records- 0198US8987922B2Methods and apparatus for wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 24, 2015·65 cites·20 claims
- 0297US11101209B2Redistribution structures in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·20 cites·19 claims
- 0396US9564416B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·25 cites·20 claims
- 0495US10026671B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 17, 2018·27 cites·20 claims
- 0591US9059109B2Package assembly and method of forming the sameLIN HUNG-JEN·Filed 2012·Granted Jun 16, 2015·15 cites·20 claims
- 0686US10074604B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·5 cites·20 claims
- 0786US6638409B1Stable plating performance in copper electrochemical platingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 28, 2003·33 cites·9 claims
- 0885US9691723B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·3 cites·20 claims
- 0984US9673158B2Formation of connectors without UBMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·4 cites·20 claims
- 1081US9559071B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·18 claims
- 1181US9396973B2Methods and apparatus for wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·3 cites·21 claims
- 1277US10665565B2Package assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·1 cites·20 claims
- 1377US9859267B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·2 cites·20 claims
- 1477US6774395B1Apparatus and methods for characterizing floating body effects in SOI devicesADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 10, 2004·25 cites·25 claims
- 1575US6777708B1Apparatus and methods for determining floating body effects in SOI devicesADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 17, 2004·20 cites·29 claims
- 1675US2024379535A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1775US2022359436A1Connector Formation Methods and Packaged Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1874US2024234302A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1972US10483132B2Post-passivation interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 19, 2019·2 cites·22 claims
- 2069US9780064B2Method of forming package assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·1 cites·20 claims
- 2169US8987605B2Formation of connectors without UBMWANG TSUNG-DING·Filed 2011·Granted Mar 24, 2015·2 cites·19 claims
- 2266US11424199B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 2363US12142560B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 2462US10777431B2Post-passivation interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 2561US10651055B2Post-passivation interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 2660US9935038B2Semiconductor device packages and methodsWANG TSUNG DING·Filed 2012·Granted Apr 3, 2018·1 cites·20 claims
- 2759US10867957B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 2859US10522486B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims
- 2958US10192848B2Package assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 3055US10728419B2System and method using matrix barcode information to perform point-to-point information exchangeAVISION INC·Filed 2019·Granted Jul 28, 2020·0 cites·20 claims
- 3155US10163846B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 3253US12494434B2Semiconductor packages and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 9, 2025·0 cites·20 claims
- 3349US2018177159A1Bee-keeping equipment and temperature adjusting device thereofUNIV NAT TAIWAN·Filed 2017·Application pending·0 cites
- 3447US10896220B2Method of searching an image file in a computer system, related image file searching device, and related computer systemAVISION INC·Filed 2018·Granted Jan 19, 2021·0 cites·17 claims
- 3546US11394837B2System and method using matrix barcode information to process documentsAVISION INC·Filed 2019·Granted Jul 19, 2022·0 cites·19 claims
- 3645US2014002857A1Document scanning method and computer program for controlling scanning apparatusAVISION INC·Filed 2013·Application pending·0 cites
- 3744US7679972B2High reliable and low power static random access memorySPANSION LLC·Filed 2007·Granted Mar 16, 2010·1 cites·20 claims
- 3839US7176081B2Low temperature method for metal depositionTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Feb 13, 2007·0 cites·16 claims
- 3938US6949471B2Method for fabricating poly patternsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 27, 2005·0 cites·29 claims
- 4035US11857282B2Multi-segment rotation robotic armHUANG HAN I·Filed 2021·Granted Jan 2, 2024·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Hung-Jen Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →