Inventor · disambiguated record
Hui-Ping Lin
Also filed as: LIN HUI · LIN HUI-PING
1 granted patent·2 pending applications·1 citations·filing 2010–2019
16Inventor score
Top patents by PatentIndex Score
3 records- 0146US8522893B2Modularized ultrasonic vibration machining apparatusYang zhong-yi·Filed 2010·Granted Sep 3, 2013·1 cites·20 claims
- 0237US2018267920A1Expansion componentLENOVO BEIJING CO LTD·Filed 2018·Application pending·0 cites
- 0330US2021138697A1Shaping material extruding hollow module fabricating equipment and fabricating method of foamed shaping material having enclosing veneerLin hui ping·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →