Inventor · disambiguated record
Hung-Hua Lin
Also filed as: LIN HUNG-HUA
46 granted patents·6 pending applications·411 citations·filing 2009–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD40TAIWAN SEMICONDUCTOR MFG4TSAI SHANG-YING2CHENG CHUN-REN1HUANG Xin-hua1
Top patents by PatentIndex Score
52 records- 0199US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
- 0298US9181083B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·52 cites·20 claims
- 0397US11812664B2Pizoelectric MEMS device with electrodes having low surface roughnessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
- 0496US10665449B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·5 cites·20 claims
- 0595US11932534B2MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·2 cites·20 claims
- 0694US12185631B2Pizoelectric MEMS device with electrodes having low surface roughnessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·1 cites·20 claims
- 0792US8647962B2Wafer level packaging bondLIU MARTIN·Filed 2010·Granted Feb 11, 2014·14 cites·13 claims
- 0891US9446467B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·9 cites·19 claims
- 0990US11050012B2Method to protect electrodes from oxidation in a MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·20 claims
- 1090US8905293B2Self-removal anti-stiction coating for bonding processLIU PING-YIN·Filed 2010·Granted Dec 9, 2014·12 cites·19 claims
- 1189US8846129B2Biological sensing structures and methods of forming the sameLIN HUNG-HUA·Filed 2012·Granted Sep 30, 2014·10 cites·20 claims
- 1288US10280076B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 7, 2019·3 cites·20 claims
- 1387US12234141B2Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1487US2024367964A1Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1586US12255062B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1686US10266390B2Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·2 cites·20 claims
- 1785US10294098B2Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·4 cites·20 claims
- 1885US8405169B2Handling layer for transparent substrateCHENG CHUN-REN·Filed 2010·Granted Mar 26, 2013·8 cites·20 claims
- 1982US2024367965A1Conductive bond structure to increase membrane sensitivty in mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2079US12139399B2Conductive bond structure to increase membrane sensitivity in MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2179US11279615B2Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
- 2279US2024368746A1Undercut-free patterned aluminum nitride structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2378US11854795B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2478US2023249961A1Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2577US11827513B2Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 2677US2025162859A1Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2775US12134824B2Undercut-free patterned aluminum nitride structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
- 2875US2022340413A1Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2973US9776858B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·2 cites·20 claims
- 3073US9508586B2Debonding schemesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·2 cites·20 claims
- 3172US11180363B2Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 3271US11634318B2MEMs using outgassing material to adjust the pressure level in a cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 25, 2023·0 cites·19 claims
- 3371US10464808B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 3470US11292715B2Conductive bond structure to increase membrane sensitivity in MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·0 cites·20 claims
- 3570US8633086B2Power devices having reduced on-resistance and methods of their manufactureKALNITSKY ALEX·Filed 2009·Granted Jan 21, 2014·3 cites·24 claims
- 3669US8945344B2Systems and methods of separating bonded wafersHUANG Xin-hua·Filed 2012·Granted Feb 3, 2015·2 cites·16 claims
- 3768US11371133B2Undercut-free patterned aluminum nitride structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 3866US9242853B2Method of improving getter efficiency by increasing superficial areaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 26, 2016·1 cites·18 claims
- 3965US11282697B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 4065US9377401B2Biological sensing structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·0 cites·20 claims
- 4164US11130670B2MEMS devices with an element having varying widthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 4264US10119909B2Biological sensing structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 6, 2018·0 cites·20 claims
- 4364US8735260B2Method to prevent metal pad damage in wafer level packageTSAI SHANG-YING·Filed 2010·Granted May 27, 2014·1 cites·20 claims
- 4463US10981781B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 4563US10781098B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 4659US9611141B2Self-removal anti-stiction coating for bonding processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 4, 2017·0 cites·20 claims
- 4754US9741681B2Debonding schemesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·0 cites·20 claims
- 4854US9293445B2Wafer level packaging bondTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·0 cites·19 claims
- 4952US9708179B2Method of improving getter efficiency by increasing superficial areaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·0 cites·20 claims
- 5048US8853801B2MEMS devices and methods of forming the sameTSAI SHANG-YING·Filed 2012·Granted Oct 7, 2014·0 cites·19 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →